If not, achieving a reasonable yield becomes a trade-off exercise, which could be so severe as to produce a non-overlapping zero-yielding solution. If these sensitivities all align, they can be systematically offset to improve yield. DescriptionĮach circuit and each circuit metric may have its own sensitivities to process, temperature, voltage, signal and other environmental conditions. In some embodiments, the derived process corners may better represent physically possible worst-case process corners than traditional general-purpose process corners, and may address differences in process sensitivities for individual circuits of the device. The model may also be used to simulate process shifts and exaggerated input ranges for critical device parameters. A surrogate simulation model, such as a Response Surface Model, may be generated from circuit simulation data or parametric data measurements and may be executed using a large number of multi-variable sample points to determine process corners defining yield limits for a device. The method may be used to determine individual performance metric yields, the number of out-of-specification conditions for a given number of simulation samples, and a total yield prediction for simultaneous multi-variable conditions. G05B17/02- Systems involving the use of models or simulators of said systems electricĪ system and method for deriving semiconductor manufacturing process corners using surrogate simulations is disclosed.G05B17/00- Systems involving the use of models or simulators of said systems.G05B15/02- Systems controlled by a computer electric.G05B15/00- Systems controlled by a computer.G05B- CONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS.Status Active legal-status Critical Current Adjusted expiration legal-status Critical Links Assignors: Oracle America, Inc., ORACLE USA, INC., SUN MICROSYSTEMS, INC. MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Publication of US20080195359A1 publication Critical patent/US20080195359A1/en Application granted granted Critical Publication of US7716023B2 publication Critical patent/US7716023B2/en Assigned to Oracle America, Inc. Assignors: RUSSELL, EDMUND L., III, BARKER, AARON J. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc Priority to US11/674,572 priority Critical patent/US7716023B2/en Assigned to SUN MICROSYSTEMS, INC. Original Assignee Sun Microsystems Inc Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) Russell Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Granted Application number US11/674,572 Other versions US7716023B2
#How to calculate ppm defective given shift and sigma level pdf
Google Patents Multidimensional Process Corner Derivation Using Surrogate Based Simultaneous Yield Analysisĭownload PDF Info Publication number US20080195359A1 US20080195359A1 US11/674,572 US67457207A US2008195359A1 US 20080195359 A1 US20080195359 A1 US 20080195359A1 US 67457207 A US67457207 A US 67457207A US 2008195359 A1 US2008195359 A1 US 2008195359A1 Authority US United States Prior art keywords corners surrogate candidate semiconductor parameters Prior art date Legal status (The legal status is an assumption and is not a legal conclusion.
![how to calculate ppm defective given shift and sigma level how to calculate ppm defective given shift and sigma level](https://connect.buildnext.in/wp-content/uploads/2020/04/image-16.png)
Google Patents US20080195359A1 - Multidimensional Process Corner Derivation Using Surrogate Based Simultaneous Yield Analysis US20080195359A1 - Multidimensional Process Corner Derivation Using Surrogate Based Simultaneous Yield Analysis